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| FCR, RCA, RCN Series are formed by vacuum depositing a resistive alloy on a usually flat substrate of ceramic. Photo-lithographic or similar techniques are used to define the final geometry and interconnecting traces. This technology provides for close ratio matching and tracking in a network, as well as low stand-alone temperature coefficient and resistance tolerance. Types includes precision smd (FCR), smd array (RCA), and networks (RCN). |  |
| Chip Thick Film Dimension |
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| Chip Thick Film Characteristic |
| Type | Power Rating at 70°C |
Max. RCWV |
Max. Overload Voltage |
Resistance Tolerance(%) |
Resistance Range (Ω) | Standard Resistance Values |
|
| Min. | Max. | ||||||
| FCR03 | 1/10W | 50V | 100V | ± 1% (F) ± 5% (J) |
10Ω 1Ω |
1MΩ 10MΩ |
E-96 E-24 |
| FCR05 | 1/8W | 150V | 300V | ± 1% (F) ± 5% (J) |
10Ω 1Ω |
1MΩ 10MΩ |
E-96 E-24 |
| FCR06 | 1/4W | 200V | 300V | ± 1% (F) ± 5% (J) |
10Ω 1Ω |
1MΩ 10MΩ |
E-96 E-24 |
| Chip Array Dimension |
| Dimensions Type |
L | W | H | L1 | L2 | P | Q |
| RCA03-4D (0603) |
3.2±0.2 | 1.6±0.15 | 0.5±0.1 | 0.30±0.15 | 0.35Max | 0.8±0.1 | 0.5±0.1 |
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| Chip Array Characteristic |
| Type | Rated Power at70°C |
Max. Working Voltage |
Max. Overload Voltage |
T.C.R. (ppm/°C) |
Resistance Range | Jumper Rated Current |
Jumper Resistance Value |
Operating Temperature Range |
|
| F(±1%) E-96 |
G(±2%) J(±5%) E-24 |
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| RCA03-4D (0603) |
0.063 | 50V | 100V | ± 200 | 100Ω~470KΩ | 10Ω~1MΩ | 1A | 50mΩ MAX |
-55°C~+125°C |
| Chip Network Dimension |
| Dimensions Type |
L | W | H | L1 | L2 | P | Q |
| RCN06-10R RCN06-10S |
6.4 ± 0.2 | 3.1 ± 0.2 | 0.55 ± 0.1 | 0.5 ± 0.3 | 0.5 ± 0.2 | 1.27 ± 0.1 | 0.8 ± 0.2 |
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| Chip Network Characteristic |
| Type | Rated Power at70°C |
Max. Working Voltage |
Max. Overload Voltage |
T.C.R. (ppm/°C) |
Resistance Range | Number of Terminals |
Number of Elements |
Operating Temperature Range |
| J (±5%) E-12 | ||||||||
| RCN06-10R RCN06-10S |
1/16W | 50V | 100V | ±200 | 10Ω~1MΩ | 10 | 8 | -55°C~+125°C |
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